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Khor Soon Fuat
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| Total Publications : 1 |
| Total Downloads : 0 |
| Latest Submission: |
| Published: 2019-02-15 15:39:54.055 |
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Title
 | Submission Date | Version | Published Under | Contribution | Downloads |
| Lattice Boltzmann Method (LBM) study on effect of solder bump arrangement on Ball Grid Array (BGA) underfilling process | 2019-02-15 15:39:54.055 | 1 | Khor Soon Fuat | Author | 0 |
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