Mohamad Afiq Mohamad Zulkefflee
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Title | Submission Date | Version | Published Under | Contribution | Downloads |
Numerical study on effect of gap thickness, surface roughness, solder bump placements and temperature on underfill flow | 2020-02-06 10:21:08.664 | 1 | Mohamad Afiq Mohamad Zulkefflee | Author | 0 |