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Mohamad Afiq Mohamad Zulkefflee
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| Total Publications : 1 |
| Total Downloads : 0 |
| Latest Submission: |
| Published: 2020-02-06 10:21:08.664 |
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Title
 | Submission Date | Version | Published Under | Contribution | Downloads |
| Numerical study on effect of gap thickness, surface roughness, solder bump placements and temperature on underfill flow | 2020-02-06 10:21:08.664 | 1 | Mohamad Afiq Mohamad Zulkefflee | Author | 0 |
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