(For USM Staff/Student Only)
|
MJMS
|
| Total Publications : 1 |
| Total Downloads : 0 |
| Latest Submission: |
| BS 4584-103.1: 1990 IEC 249-3-1: 1981 : ... |
| Published: 2023-10-23 16:09:42.937 |
| Most Downloaded: |
| BS 4584-103.1: 1990 IEC 249-3-1: 1981 : ... |
| Downloads: 0 |
Viewing: 1 - 1 of 1
1
Title
 | Submission Date | Version | Published Under | Contribution | Downloads |
| BS 4584-103.1: 1990 IEC 249-3-1: 1981 : Metal-clad base materials for printed wiring boards — Part 103: Special materials used in connection with printed circuits — Section 103.1 Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed boards | 2023-10-23 16:09:42.937 | 1 | MJMS | Data Entry Person | 0 |
1
Engineering Library USM @ 2017