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BS 4584-103.1: 1990 IEC 249-3-1: 1981 : Metal-clad base materials for printed wiring boards — Part 103: Special materials used in connection with printed circuits — Section 103.1 Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed boards

BS 4584-103.1: 1990 IEC 249-3-1: 1981 : Metal-clad base materials for printed wiring boards — Part 103: Special materials used in connection with printed circuits — Section 103.1 Specification for prepreg for use as a bonding sheet material in the fabrication of multilayer printed boards

Description Printed version of this standard is available at Library. To request, please e-mail to referencepk@usm.my and include a copy of this record in your e-mail. Abstract This specification gives requirements for properties of two types of epoxide resin impregnated woven glass fabric with the resin cured to a B-stage. They are used for bonding together printed circuits formed from metal-clad epoxide glass laminated to produce multilayer printed boards.

Contributor(s): MJMS - Data Entry Person Primary Item Type: British Standard Identifiers: ICS 31.180 Printed circuits and boards ISBN 0580181723 Language: English Subject Keywords: Flameproof materials; Sheet materials; Printed-circuit boards; Printed circuits; Permittivity; Thickness measurement; Test specimens; Marking First presented to the public: 10/23/2023 Original Publication Date: 2/28/1990 Previously Published By: British Standards Institution Place Of Publication: London, United Kingdom Citation: Extents: Number of Pages - 8 License Grantor / Date Granted:   / ( View License ) Date Deposited 2023-10-23 16:09:42.937 Submitter: Mohd Jasnizam Mohd Salleh

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