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Modeling and simulation for transient thermal analysis using the latency insertion method

Modeling and simulation for transient thermal analysis using the latency insertion method / New Boon Chun
Dalam tesis ini, teknik pemodelan litar setara termal telah dicadangkan dan digabungkan dengan Teori Pemasukan Latensi untuk mencari pengedaran suhu masalah termal. Kajian ini menumpukan kepada prestasi analisis termal dengan pemodelan dan simulasi litar bersamaan terma. Dalam projek ini, masalah termal yang mewakili struktur IC telah disediakan terlebih dahulu. Seterusnya, ia dimodelkan ke dalam litar bersamaan termal dengan unsur-unsur seperti rintangan termal dan kapasiti haba dengan menggunakan analogi antara sistem terma dan sistem elektrik. Kemudian, litar tersebut disimulasikan dengan algoritma simulasi cepat iaitu kaedah pemasukkan latensi (LIM). Kaedah ini memasukkan latensi ke dalam semua nod dan cawangan litar untuk mencari voltan nod dan arus cawangan pada setiap langkah masa. Keadaan kestabilan berangka telah ditubuhkan untuk menjamin kestabilan algoritma LIM. Dalam bahagian keputusan, tindak balas haba sementara bagi litar bersamaan terma akan ditunjukkan. Tanggapan sementara adalah bentuk eksponen yang mantap di mana keadaan mantap di sekitar 80° C dengan langkah masa 28ns. Selain itu, terdapat peta berwarna menunjukkan pengedaran suhu dalam terma objek tersebut. Untuk simulasi litar bersamaan terma, langkah masa yang berlainan digunakan untuk menganalisis kestabilan algoritma LIM. Secara keseluruhannya, algoritma LIM telah menunjukkan kekuatan pada ketepatan apabila keadaan simulasi stabil. Walau bagaimanapun, ia mempunyai kelemahan dalam kriteria kestabilan kerana memerlukan masa kecil untuk mencapai keadaan kestabilannya. _______________________________________________________________________________________________________ In this thesis, a modeling technique of thermal equivalent circuit is proposed and combined with a Latency Insertion Method to find the temperature distribution of the thermal problem. The research is focused into the thermal analysis performance by modeling and simulation of thermal equivalent circuit. In this project, a thermal problem representing an IC structure is set-up first. Next, it is modeled into the thermal equivalent circuit with elements such as thermal resistance and thermal capacitance by using analogy between thermal system and electrical system. The circuit is then simulated with a fast- transient simulation algorithm which is Latency Insertion Method (LIM). A numerical stability condition is established to guarantee the stability of LIM algorithm with a small time-step size is used. For the result, the transient thermal response of the thermal equivalent circuit will be shown. The transient response is a stable exponential shape in which its steady state at around 80°C with a time step of 28ns. Besides, there will be a color map shows the temperature distribution of the thermal sample problem. For the simulation of thermal equivalent circuit, different time steps are used to analyze the stability of LIM algorithm. In overall, LIM algorithm has shown its strength on the accuracy when the simulation condition is stable. However, it has limitation on stability criteria as it needs a small time step to achieve its stability condition.
Contributor(s):
New Boon Chun - Author
Primary Item Type:
Final Year Project
Identifiers:
Accession Number : 875008589
Language:
English
Subject Keywords:
thermal; circuit; (LIM)
First presented to the public:
6/1/2019
Original Publication Date:
3/3/2020
Previously Published By:
Universiti Sains Malaysia
Place Of Publication:
School of Electrical & Electronic Engineering
Citation:
Extents:
Number of Pages - 68
License Grantor / Date Granted:
  / ( View License )
Date Deposited
2020-03-03 12:07:33.079
Date Last Updated
2020-12-11 12:09:40.936
Submitter:
Mohd Jasnizam Mohd Salleh

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