(For USM Staff/Student Only)

EngLib USM > Ω School of Electrical & Electronic Engineering >

Development of an embedded system for non-contact measurement of equipment temperature using thermal array sensor

Development of an embedded system for non-contact measurement of equipment temperature using thermal array sensor / Kenneth Tang Hung Peng
Kecacatan elektrik menjadi kebimbangan utama pada masa kini dan boleh menyebabkan kegagalan fungsi peralatan, kerugian kewangan, dan menimbulkan risiko kebakaran. Oleh itu, pengesanan awal daripada kacacatan elektrik amat penting untuk mengelakkan kecacatan elektrik berlaku lagi. Suhu yang tidak normal boleh menjadi tanda awal potensi kacacatan elektrik. Mengukur suhu peralatan menjadi penting untuk mengelakkan berlakunya kecacatan elektrik. Terdapat pelbagai cara untuk mengukur suhu peralatan termasuklah dengan menggunakan kenalan atau bukan sentuhan termometer. Dalam kajian ini, sistem pengesanan bukan sentuhan termometer telah dibangunkan dengan kos yang murah untuk pemantauan berterusan dan mengukur suhu peralatan. Bukan sentuhan termometer ini (MLX90621) telah berhubung dengan Raspberry Pi 3 (RPi3) dengan menggunakan Bahasa C untuk membenarkan penghantaran suhu haba data melalui kaedah I2C. Suhu cip mutlak (Ta) dan suhu objek (To) telah dikenal pasti melalui beberapa pengiraan. Suhu objek akan tukar kepada haba peta dan dipaparkan dalam skrin LCD dengan imej yang ditangkap oleh Noir kamera. Skrin LCD dan Noir kamera telah berhubung dengan RPI 3 dengan menggunakan Python. Warna yang berbeza mewakili suhu objek yang berbeza telah dipaparkan pada skrin LCD dengan ambang larasan. _______________________________________________________________________________________________________ Electric fault has become a major concern nowadays and can cause equipment failure, financial losses and pose risks of fire. Hence, early detection of electric fault is important in preventing electric fault to happen. Abnormal temperature could be an early sign of potential electric fault. Measuring equipment temperature is vital to prevent electric fault. There are different ways to measure equipment temperature including the use of the contact or non-contact thermometer. In this study, non-contact thermometer embedded system was developed with low cost for continuous monitoring and measuring the equipment temperature. This non-contact thermometer (MLX90621) was communicated with Raspberry Pi 3 (RPi3) by using C language to allow transmit the thermal data via I2C method. The absolute chip temperature (Ta) and object temperature (To) were identified through some calculation. The object temperature will be converted to heat map and displayed in the LCD screen with the preview image captured by NoIR (No Infrared) camera module. The LCD screen and NoIR camera were communicated with RPi 3 by using python. Different colorswhich represent different object temperature were presented on the LCD screen with adjusted threshold.
Contributor(s):
Kenneth Tang Hung Peng - Author
Primary Item Type:
Final Year Project
Identifiers:
Accession Number : 875007194
Barcode : 00003107072
Language:
English
Subject Keywords:
Electric fault; cause equipment failure; non-contact thermometer
First presented to the public:
6/1/2017
Original Publication Date:
4/17/2018
Previously Published By:
Universiti Sains Malaysia
Place Of Publication:
School of Electrical & Electronic Engineering
Citation:
Extents:
Number of Pages - 93
License Grantor / Date Granted:
  / ( View License )
Date Deposited
2018-04-17 15:15:38.782
Date Last Updated
2019-01-07 11:24:32.9118
Submitter:
Mohd Jasnizam Mohd Salleh

All Versions

Thumbnail Name Version Created Date
Development of an embedded system for non-contact measurement of equipment temperature using thermal array sensor1 2018-04-17 15:15:38.782