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DD ENV 50219:1996- Description of the reliability test structures of the European mini test chip

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The purpose of the reliability test chip RTC is to provide a minimum set of test structures for a fast reliability assessment of emerging CMOS technologies down to 0.5 µm. The basic test structures described in this document are used as test vehicles to obtain information about failure mechanisms even in non-mature semiconductor technologies. The failure mechanisms which are addressed by the RTC are the following: 1- latch up 2- hot carrier degradation of transistors 3-time dependent dielectric breakdown of thin oxides 4- electromigration in metal lines and contacts The number of test samples and the failure criteria will depend on the purpose of the tests. Guidelines are given in [8].
Contributor(s):
NAAR - Data Entry Person
Primary Item Type:
British Standard
Identifiers:
ISBN 0580260372
Id 35.240
ICS 31.200
Language:
English
Subject Keywords:
Description; reliability test structures; European mini test chip
First presented to the public:
2/2/2024
Original Publication Date:
9/15/1996
Previously Published By:
British Standards Institution
Place Of Publication:
London, United Kingdom
Citation:
Extents:
Number of Pages - 36
License Grantor / Date Granted:
  / ( View License )
Date Deposited
2024-02-02 11:01:48.035
Submitter:
Nurul Aini Abdul Rahman

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