BS EN 61249-5-1:1996 - Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings - Copper foils (for the manufacture of copper-clad base materials)
Current
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BS EN 61249-5-1:1996 is a British Standard that is no longer in effect. As of my knowledge cutoff in September 2021, the most recent version of this standard is BS EN 61249-5-1:2018.
BS EN 61249-5-1 specifies the requirements for materials used in the fabrication of rigid laminated sheets and printed boards for electrical and electronic applications. It provides classification and test methods for base materials, copper-clad laminates, and prepreg materials.
The standard covers various properties and characteristics of materials used in the construction of printed circuit boards (PCBs) and provides guidelines for their testing and evaluation. It includes parameters such as dimensional stability, mechanical properties, electrical properties, thermal properties, and resistance to chemicals.
It's important to note that standards can be subject to revisions and updates over time. To obtain the most current version of BS EN 61249-5-1, it is advisable to check with the British Standards Institution (BSI) or other relevant standards organizations.
BS EN 61249-5-1:1996 - Materials for interconnection structures. Sectional specification set for conductive foils and films with and without coatings - Copper foils (for the manufacture of copper-clad base materials)
