(For USM Staff/Student Only)
EngLib USM > Ω School of Mechanical Engineering >
A study of crack behavior in a qfp electronic package under the combination of thermal and pressure loading/Azizo Awang
Restricted Access - (You can try Logging In)
All Versions
| Thumbnail | Name | Version | Created Date |
| The version of this item is restricted |
Engineering Library USM @ 2017
Withdraw Publication
Reinstate Publication
Delete?
Do you want to delete this Institutional Publication?