BS CECC 00803:1996 - Harmonized system of quality assessment for electronic components. Guidance document:visual inspection of soldered surface mounted assemblies
Printed version of this is available at library. To request, please e-mail to referencepk@usm.my and include a copy of this record in your e-mail.
This guidance document applies to visual inspection criteria for electronic assemblies containing surface
mounted components.
The solder joint inspection requirements of this specification are applicable for component lead pitches
down to 0.635 mm and for leadless components down to plan size 0603 (1.5 × 0.75 mm) or to 1.0 mm
diameter. An extended version of this specification will apply both to smaller components and to thermode
(hot bar) and laser soldering-the latter methods not being covered by the present text and drawings.
The following areas, based upon tin lead alloy soldering are covered:
1) unpopulated printed boards;
2) solder paste and adhesive deposition;
3) shape of the soldered joint;
4) position of the component and soldered joint;
5) conditions of the components;
6) degree of wetting between component termination and the substrate.
The inspection shall lead to decisions as to whether:
— the soldered joints are acceptable;
— the soldered joint(s) should be rejected and eventually repaired
and/or
— the assembly process should be improved
— the component is in an acceptable condition.
BS CECC 00803:1996 - Harmonized system of quality assessment for electronic components. Guidance document:visual inspection of soldered surface mounted assemblies
