DD ENV 50219:1996- Description of the reliability test structures of the European mini test chip
Printed version of this is available at library. To request, please e-mail to referencepk@usm.my and include a copy of this record in your e-mail.
The purpose of the reliability test chip RTC is to provide a minimum set of test structures for a
fast reliability assessment of emerging CMOS technologies down to 0.5 µm. The basic test
structures described in this document are used as test vehicles to obtain information about failure
mechanisms even in non-mature semiconductor technologies.
The failure mechanisms which are addressed by the RTC are the following:
1- latch up
2- hot carrier degradation of transistors
3-time dependent dielectric breakdown of thin oxides
4- electromigration in metal lines and contacts
The number of test samples and the failure criteria will depend on the purpose of the tests.
Guidelines are given in [8].
