BS EN 61249-7-1:1996 - Materials for interconnection structures. Sectional specification set for restraining core materials - Copper/invar/copper
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BS EN 61249-7-1:1996 is a European standard that specifies requirements for materials used in the fabrication of multilayer printed boards. It is part of the BS EN 61249 series, which covers the classification and performance specifications for printed boards.
Specifically, BS EN 61249-7-1:1996 focuses on the materials used in the construction of multilayer printed boards. It provides definitions, classification, and performance requirements for the base materials used in multilayer boards, including their dimensional, electrical, mechanical, and thermal properties.
The standard defines different types and grades of base materials based on their composition, such as epoxy resin-based materials, paper-based materials, and composite materials. It also specifies various properties that the materials should meet, such as dielectric constant, thermal conductivity, tensile strength, and coefficient of thermal expansion.
BS EN 61249-7-1:1996 is intended to ensure that the materials used in multilayer printed boards are suitable for their intended applications and meet certain quality standards. Compliance with this standard helps manufacturers and designers select appropriate materials for multilayer boards and ensures consistency and reliability in their performance.
It's worth noting that the information provided here is based on the knowledge available up to September 2021, and there may have been updates or revisions to the standard since then. Therefore, it is always recommended to refer to the latest version of the standard for the most accurate and up-to-date information.
Primary Item Type:
British Standard
Identifiers:
ISBN 0580260313
ICS 31.180 Printed circuits and boards
Language:
English
Subject Keywords:
Thickness; Surface treatment; Sheet materials; Printed-circuit boards; Marking; Tensile strength; Modulus of elasticity; Thermal properties of materials; Ferronickel; Rolls; Metal coatings; Grades (quality); Electrical resistivity; Printed-circuit bases; Printed circuits; Elongation at fracture; Preferred sizes; Copper; Chemical composition; Thermal expansion
