BS EN 60068-2-44:1995 Environmental testing. Part 2. Test methods - Tests. Guidance on Test T. Soldering
Withdrawn
Printed version of this is available at library. To request, please e-mail to referencepk@usm.my and include a copy of this record in your e-mail.
The purpose of this International Standard is to provide background information and recommendations for writers of specifications containing references to IEC 68-2-20, IEC 68-2-54 and IEC 68-2-58. 2
Normative references
The following normative documents contain provisions which, through reference in this text, constitute provisions of this part of IEC 68. At the time of publication of this standard, the editions indicated were valid. All normative documents are subject to revision, and parties to agreements based on this part of IEC 68 are encouraged to investigate the possibility of applying the most recent editions of the normative documents indicated below. Members of IEC and ISO maintain registers of currently valid International Standards.
IEC 68-2-20:1979, Environmental testing - Part 2: Tests -Test T: Soldering Amendment 2 (1987).
IEC 68-2-54:1985, Basic environmental testing procedures - Part 2: Tests - Test Ta: Soldering - Solderability testing by the wetting balance method.
IEC 68-2-58:1989, Environmental testing - Part 2: Tests - Test Td: Solderability, resistance to dissolution of metallization and to soldering heat of Surface Mounting Devices (SMD).
Series IEC 249, Base materials for printed circuits.
IEC 326-2:1990, Printed boards - Part 2: Test methods.