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BS EN 29453:1994 ISO 9453:1990 : Soft solder alloys — Chemical compositions and forms

BS EN 29453:1994 ISO 9453:1990 : Soft solder alloys — Chemical compositions and forms
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This International Standard specifies the requirements for chemical composition for following families of soft solder alloys: - tin-lead, with and without antimony; - tin-silver, with and without lead; - tin-copper, with and without lead; - tin-anitmony; - tin-lead-bismuth; - bismuth-tin; - tin-lead-cadnium; - tin-indium; - lead-silver, with and without tin. An indication of forms generally available is also included.
Contributor(s):
MJMS - Data Entry Person
Primary Item Type:
British Standard
Identifiers:
ICS  25.160.50 Brazing and soldering
ISBN  0580222551
Language:
English
Subject Keywords:
Joining materials; Lead-containing alloys; Indium-containing alloys; Solders; Chemical composition; Shape; Silver-containing alloys; Tin alloys; Antimony-containing alloys; Lead alloys; Bismuth-containing alloys; Copper-containing alloys; Marking; Cadmium-containing alloys
First presented to the public:
5/3/2023
Original Publication Date:
2/15/1994
Previously Published By:
British Standards Institution
Place Of Publication:
London, United Kingdom
Citation:
Extents:
Number of Pages - 6
License Grantor / Date Granted:
  / ( View License )
Date Deposited
2023-05-04 22:18:40.166
Submitter:
Mohd Jasnizam Mohd Salleh

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BS EN 29453:1994 ISO 9453:1990 : Soft solder alloys — Chemical compositions and forms1 2023-05-04 22:18:40.166
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