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BS EN 61249-8-8:1997- Materials for interconnection structures. Part 8. Sectional specification set for non-conductive films and coatings - Section 8. Temporary polymer coatings

Description Printed version of this is available at library. To request, please e-mail to referencepk@usm.my and include a copy of this record in your e-mail. Abstract Provides requirements for the qualification of temporary solder resist coatings. Requirements stated in this specification will also have some limited validity for assessing the suitability of printed boards which are supplied with peelable solder masks.

Contributor(s): MFAR - Data Entry Person Primary Item Type: British Standard Identifiers: ICS 31.180 Printed circuits and boards ISBN 0580284654 Language: English Subject Keywords: Coatings; Polymers; Printed-circuit bases; Printed-circuit boards; Films (states of matter); Marking; Printed circuits; Solderability testing; Solvent-resistance tests; Adhesion tests; Thermal-shock tests; Contact resistance; Peeling tests; Chemical-resistance tests; Temporary First presented to the public: 5/20/2024 Original Publication Date: 12/15/1997 Previously Published By: British Standards Institution Place Of Publication: London, United Kingdom Citation: Extents: Number of Pages - 11 License Grantor / Date Granted:   / ( View License ) Date Deposited 2024-05-21 02:42:55.641 Submitter: Mohd Fadli Abd. Rahman

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