Solder paste is a specially mixture or blended paste that printed in the area of solder pad and then reflowed to form the solder joints with the Surface Mount Technology component. Before the SMT component is being attached on the Printed Circuit Board, the solder paste will be inspected to detect any defects. Those defects are such as missing, less, over and misalignment. Here, solder paste inspection algorithm is carried out through the use of the Euresys image processing software tools, eVision. The eVision will interface with the Visual Basic 6.0 to run the inspection. There are two steps of solder inspection are done; that is teaching and inspection. The methodology of solder paste is the fiducial mark will be detected before the solder paste is being inspected. The use of eVision library is as a tool of image processing method such as threshold, get object information and so on. The visual basic 6.0 is played the role as Graphic User Interface. Programming interface that available in the eVision can interact with visual basic 6.0 platform. It is ActiveX and its syntax is given in visual basic form. In this project, the eVision software is used to improve the time of the compile process.
Vision image processing for solder paste inspection using euresys_Yeoh Seok Khim_E3_2006_NI