(For USM Staff/Student Only)
EngLib USM > Ω School of Mechanical Engineering >
Thermal stress analysis in layered microelectronics packaging or assembly/Lim Yong Shen
Restricted Access - (You can try Logging In)
All Versions
| Thumbnail | Name | Version | Created Date |
| The version of this item is restricted |
Engineering Library USM @ 2017
Withdraw Publication
Reinstate Publication
Delete?
Do you want to delete this Institutional Publication?