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 | Publication Date | First Public Date | Contributors |
| 3D Integration for VLSI Systems /Chuan Seng Tan, Kuan-Neng Chen, Steven J. Koester Three-dimensional (3D) integration is identified as a possible avenue for continuous performance growth in integrated circuits (IC) as the conventional scaling approach is faced with unprecedented challenges in fundamental and economic limits. Wafer level 3D IC can take several forms, and they usually include a stack of several thinned IC layers th... | 5/28/2019 | 4/19/2016 | Chuan Seng Tan - Author Kuan-Neng Chen - Author Koester Steven J. - Author | |
| 3d integration in vlsi circuits-implementation technologies and applications /Katsuyuki Sakuma Currently, the term 3D integration includes a wide variety of different integration methods, such as 2.5-dimensional (2.5D) interposer-based integration, 3D integrated circuits (3D ICs), 3D systems-in-package (SiP), 3D heterogeneous integration, and monolithic 3D ICs. The goal of this book is to provide readers with an understanding of the latest c... | 5/29/2019 | 4/24/2018 | Katsuyuki Sakuma - Author | |
| 4d cad and visualization in construction_developments and applications/Raymond Issa, I. Flood, W. O'Brien The first part of this paper presents an extensive list of benefits users of 4D models have realized and illustrates the benefits with specific examples from actual uses on a variety of projects. It illustrates how current business practices and project delivery approaches allow or do not allow facility owners to reap these benefits. All owners and... | 5/29/2019 | 4/16/2007 | O'Brien, William J - Author Issa, Raymond - Editor | |
| 50 years in the semiconductor underground/David K. Ferry This book was derived from a talk that the author gave at the International Conference on Advanced Nanodevices and Nanotechnology in Hawaii. The book is about science and engineering, but is not on science and engineering. It is not a textbook which develops the understanding of a small part of the field, but a book about random encounters and abou... | 5/29/2019 | 5/27/2015 | Ferry, David K - Author |
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